Research laboratories

The research is conducted on modern, well equipped laboratories of the Faculty of Electrical Engineering and Communication at Technicka 10. Owing the top level equipment our research teams achieve remarkable results, nationally and internationally appreciated at conferences, by prestigious impact journals, and our industrial partners. Below you can find an outline of our equipment available for all types of projects.

Research on integrated circuits is conducted in the Laboratory of integrated circuits design equipped with the workstation DELL and appropriate software, particularly the professional design environment CADENCE. We are also able to test and programme developed chips, which can also be done in the Laboratory of research and development.

All workplaces for microsensors and nanotechnology are located in the Laboratory of microsensors and nanotechnology (LabSensNano), part of the project SIX (Centre for sensoric, information and communications systems). There are some specialized workplaces: bioelectrochemical and chemical equipment for synthesis of materials equipped with an inert glove box and adapted microwave chamber for preparation of nanoparticles. Also available is the apparatus AGILENT 4284A for impedance spectroscopy, VOLTALAB 50 and PALMSENS, CH-INSTRUMENTS, AUTOLAB, VA Computerace for potentiometric, voltammetric and amperometric measurements: including fully automated analyses. The utilized technique is liquid chromatography with amperometric and coulochemical detection and quartz microbalance –RQCM. Biological experiments are carried out in a clean workplace equipped with a biohazard box and cultivation devices (separatory funnels, shakers, incubators).

The workplace for electron microscopy SEM and lithography is equipped with a scanning electron microscope MIRA LMU for near-field nanolithography, spin-coater, hot plate for resistor hardening and UV illumination, controlled unit for gas flow measurement, AGILENT apparatus and automated unit for post processing modification of chip surfaces on uncut wafers by (electro) chemical methods. Thin films are created by pyrolytic steaming, plasma etching and stripping, Si chemical etching, Si/SIO2 anodic bonding, laser cutting, Al and Au bonding with 25 m wires and complete thick-layer technology including SMD printed circuit mounting.

Research focused on microelectronic technology and packaging is carried out in laboratories equipped for thick-layer technology, surface mounting including soldering and testing of bonds, bonding of chips and packaging, design, simulation and modelling of thermal, mechanical and electrical characteristics of electronic systems from the viewpoint of final packaging in the ANSYS program. Our major technological units for microelectronic technology and packaging is the wire bonder for chips TPT and DB Dresden, testing device DAGE, inspection camera Ersascope (BGA and Flip chip control), mounting device FTITCH (for BGA and Flip chip), viscosimeter U 1201, sintering furnace BTU (up to 1000 C), laser YAG-Aurel, vapour soldering device Ascon, soldering furnace HR-65 infra (including nitrogen atmosphere), repair station Ersa IR-400 and 3D digital microscope Lynx.

Laboratory of microelectronic technology and packaging
Laboratory of microelectronic technology and packaging

Laboratory LabSensNano – box for work with magnetic nanoparticles
Laboratory LabSensNano – box for work with magnetic nanoparticles

ON Semiconductor laboratory of integrated circuits
ON Semiconductor laboratory of integrated circuits