Research and development

Research at the Department of Microelectronics involves several research areas – design of integrated circuits (chips), packaging and relevant processes, sensorics and sensor nanotechnology. An integral part of our research is programming of chips (microcontrollers) and their utilization in data control, commmunication and processing. We are also engaged in research into wireless technologies e.g. Bluetooth, ZigBee, etc. Another area of interest is optical data transmission and transmission lines.

We are involved in European Union projects (EU), projects of the Ministry of Industry and Trade (MPO), Ministry of Education (MSMT), Czech Science Foundation (GACR), Academy of Sciences (AV) and educational projects, and work on orders from our industrial partners.

Integrated circuits

Our priority is the development of chips for processing of sensor signals – mixed signal processing. These integrated circuits are intended to process signals from pressure sensors, biosensors and chemical sensors. We are engaged in research of various types of AD/DA converters or their parts such as reference sources, sampling stages or filters. Our department is the only university institute in the Czech Republic and most probably in Central Europe where integrated chips are not only developed, but also fabricated. The Europractice project enables us to produce small series of designed integrated circuits for testing in practical applications.

Microsensors and nanotechnology

Research is focused on exploitation of nanotechnology in sensorics and development of sensors of various characteristics. Nanoparticles, nanostructured and operable electrodes for electrochemical sensors and biosensors are used in the development of microsensors for detection of gases. The diagnostics and analysis of materials for human medicine are studied as well. That is why quantum dots and supermagnetic nanoparticles are included in our research.

Microelectronic technology and packaging

Research and development of advanced technologies for modern hardware involve minituarization of contacts (lead-free soldering), bonding of semiconductor chips and their packaging (BGA, MCM, SoP, BoB), cleaning of printed boards, development of ecological cleaning devices, and many applications, e.g. thermodynamic sensors (from design to industrial applications), multi-layer structures with embedded passive components, or development of novel deposition methods, the subject of a patent application.

Design of embedded systems and programming of microcomputers and microcontrollers

The most developed embedded systems at the Department of Microelectronics are measurement and monitoring systems for control of experiments and measurement with microchemical sensors, systems for automation of buildings and telemeters, and finally systems for unambigous identification of persons and devices using the latest authentication methods. The department is involved in the development of software for industrial process automation, measurement and monitoring of power sources in electromobiles and electrobuses, and software for embedded systems, desktop workstations and servers.