Manufacturing of components and construction elements (MVSK)

  • Obligatory course
  • 6 credits


Description:

The subject deals with the development of semiconductor chips, production, bonding into package or on a substrate. Individual operations are explained and demonstrated. The students will develop skills needed to prepare semiconductor components, from the simplest semiconductor components implemented by semiconductor technology to more complicated ones, including microprocessors.


Aims:

The aim of the course is to teach students the fundamental principles of design, construction and production of electronic semiconductor components, circuits and systems. The theory is focused on the physical processes taking place in semiconductors, principles of individual semiconductor components (resistors, capacitors, diodes, transistors) and on the basic production processes.

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Exercises:

Exercises take place in clean environment laboratories where students concentrate on production of a semiconductor chip. They will gradually get through the operations involved in production of chips, wafers and testing of chips.