• Szendiuch, I.: Importance of Eco-Design Implementation in Engineering Education, Begell House Publishing, USA, 2008, ISBN 978-0-9741252-6-8

  • Řezniček, M., Szendiuch, I.: Thick Film Double Thermodynamic Sensor System, Proceedings of 2nd Electronics System-Integration Technology Conference ESTC 2008, 1.-4. September 2008, Greenwich, London, UK, ISBN 978-1-4244-2813-7

  • Szendiuch, I.; Stary, J.; Šandera, J.; Buršik, M.; Hejatkova, E.: New Facts from lead-free Solder Reliability Investigation. At the 17th European Microelectronics and Packaging Conference. Rimini, Italy, IMAPS, 2009. p. 60 - 65. ISBN 978-1-4244-4722-0

  • Nicak, M.; Šandera, J.; Szendiuch, I.: Contribution to realization of 3D structures. At the 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Warsaw, Poland, IEEE Xplore digital library 2010. p. 156 - 158. ISBN 978-1-4244-7849-1

  • Buršík, M.; Szendiuch, I.; Jankovsky, J.; Hejatkova, E. New Facts from Lead-free Solder Reliability Investigation. At the Electronics Systém Integration Technology Conference ESTC 2010 in Berlin, Germany 2010. p. 1 - 5. ISBN 978-1-4244-8555-0

  • Szendiuch, I.: Development in Electronic Packaging - Moving to 3D System Configuration, Radioengineering, April 2011, Vol. 20, Number 1, p.214-220, ISSN 1210-2512

-2013-      By Martin Klíma